Vapour Phase Reflow Soldering

The liquid used is chosen with a desired boiling point in mind to suit the solder alloy to be reflowed. April 25 2013 at 5 40 am yeah even i think vapor phase reflow soldering is the best method for heating because with this method there is a low chance of overheating. Moreover the heat transferred by vapor phase is uniform on all components of the pcb reducing stresses during soldering.

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Vapour phase reflow soldering.

Vapour phase is considered to have process advantages over convection in terms of giving control and stability over the reflow cycle. The heating of the pcbs is sourced by thermal energy emitted by the phase transition of a heat transfer liquid e. The end result of the vapour phase soldering is an assembly that has been reflowed. Some advantages of vapour phase soldering are.

Vapor phase soldering transfers heat at about 100 400 w m 2 k which is considerably higher than 10 60 w m 2 k of heat transferred by convection reflow soldering. Pfpe condensing on the pcbs. Vapor phase reflow says. Vapour phase reflow soldering.

The vapour phase process involve heating up the pcb through the galden vapour an inert medium.

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